HF115AC-0.0055-AC-105
HF115AC-0.0055-AC-105
THERM PAD 36.83X21.29MM W/ADH
In Stock:
12403
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | Get latest price! | - |
| 10 | Get latest price! | - |
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Products Specifications
| Usage | SIP |
|---|---|
| Type | Pad, Sheet |
| Thickness | 0.0055" (0.140mm) |
| Thermal Resistivity | 0.35°C/W |
| Thermal Conductivity | 0.8 W/m-K |
| Shape | Rectangular |
| Series | Hi-Flow® 115-AC |
| Outline | 36.83mm x 21.29mm |
| Other Names | BER170 HF115AC-105 HF115AC00055AC105 HF115TAAC-105 |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Material | Phase Change Compound |
| Manufacturer Standard Lead Time | 2 Weeks |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Detailed Description | Thermal Pad Gray 36.83mm x 21.29mm Rectangular Adhesive - One Side |
| Color | Gray |
| Backing, Carrier | Fiberglass |
| Adhesive | Adhesive - One Side |
