
In Stock:
24343
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Products Specifications
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0045" (0.115mm) |
Thermal Resistivity | - |
Thermal Conductivity | - |
Shape | Square |
Series | THERMFLOW® T777 |
Outline | 28.00mm x 28.00mm |
Other Names | 1944-1285 69-11-42339-T777-DK |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Polymer Solder Hybrid |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Gray 28.00mm x 28.00mm Square Tacky - Both Sides |
Color | Gray |
Backing, Carrier | - |
Adhesive | Tacky - Both Sides |