W25Q32JVXGIM
RoHS

W25Q32JVXGIM

W25Q32JVXGIM

Winbond

W25Q32JVXGIM

In Stock: 6258
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Shipping Information
Shiped FromShenZhen Warehourse
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Products Specifications
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeNOR
ECCN (US)3A991.b.1.a
PackagingTube
Page Size256byte
Pin Count8
AutomotiveNo
Boot BlockYes
ECC SupportNo
PCB changed8
Part StatusActive
Sector Size4Kbyte x 1024
Timing TypeSynchronous
ArchitectureSectored
Package Width4
Interface TypeSerial (SPI, Dual SPI, Quad SPI)
Package Height0.43
Package Length4
Number of Words4M
ProgrammabilityYes
Supplier PackageXSON EP
Block OrganizationSymmetrical
Chip Density (bit)32M
Command CompatibleYes
Program Current (mA)25
Support of Page ModeNo
Max. Access Time (ns)6
Location of Boot BlockTop|Bottom
Maximum Erase Time (S)50/Chip
Operating Current (mA)25
Address Bus Width (bit)24
Programming Voltage (V)2.7 to 3.6
Number of Bits/Word (bit)8
Minimum Endurance (Cycles)100000
Supplier Temperature GradeIndustrial
Maximum Programming Time (ms)3/Page
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3.3|3